J. Daniel Binion, Eric B. Whiting, Sawyer D. Campbell, Douglas H. Werner, The Pennsylvania State University, United States; Erik Lier, Thomas H. Hand, Lockheed Martin Space, United States
Tayyab Ali Khan, City University of Hong Kong, Hong Kong SAR, China, Hong Kong SAR of China; Alex Man Hon Wong, City University of Hong Kong, Hong Kong SAR of China
Thanh Binh Nguyen, Naobumi Michishita, Hisashi Morishita, National Defense Academy, Japan; Teruki Miyazaki, Masato Tadokoro, Yokohama Rubber Co., Ltd., Japan
Shefali Pawar, Salvatore Mastromatteo, Alexander Yakovlev, University of Mississippi, United States; Hossein Bernety, University of Utah, United States; Harry Skinner, Seong-Youp Suh, Intel Corporation, United States; Andrea Alù, City University of New York, United States
Ratanak Phon, Sungjoon Lim, Chung Ang University, Korea (South)
Yiting Liu, Mingbo Xin, Rensheng Xie, Xin Fang, Guohua Zhai, Jianjun Gao, Jun Ding, East China Normal University, China; Chang Chen, University of Science and Technology of China, China
Ling-Jun Yang, Sheng Sun, University of Electronic Science and Technology of China, China; Wei E. I. Sha, Zhejiang University, China
Chenchen Liu, Yang Liu, Jianjia Yi, Xidian University, China; Hexiu Xu, Air force Engineering University, China; Shah Nawaz Burokur, UPL, Univ Paris Nanterre, France
Sana Ilyas, Aimen Raza, Fahad Ahmed, Syed M. Qasim Ali Shah, Nosherwan Shoaib, Muhammad Umar Khan, National University ofSciences and Technology (NUST), Pakistan
