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Technical Program

Paper Detail

Paper: WE-UB.1A.2
Title: Vertical Integration of RF devices using System-in-Package (SiP) technology
Session: Advanced Manufactured Structures
Track: URSI-B: Fields and Waves
Authors: Kefayet Ullah, Satheesh Bojja Venkatakrishnan, John Volakis, Florida International University, United States